Join Membership    Admin

S E M I L I N K BEST SEMICONDUCTOR SOLUTION PROVIDER

EQUIPMENT_SCRUBBER

Abatement System(Scrubber)

Introduction

Dry Scrubber Heat & Wet Scrubber Plasma & Wet Scrubber
Dimension
(mm)
· Single : W 600 x D 600 x H 1,500
· Dual : W 1,500 x D 1,100 x H 1,800
· Large : W 1,200 x D 1,150 x H 2,000
· W 700 x D 750 x H 1,650 · W 1,000 x D 800 x H 1,600
Scrubbing
Principle
Remove harmful gases at room temperature by chemical reaction between specific harmful gas and chemical absorbent without water or other heat sources. Remove harmful gases at more 700℃ (heat by electric heater, indirect heat source) by thermal oxidation made by combination of flammable gas and air Remove harmful gases at more 1,000℃ (generate plasma Arc using electric) by PFCs gas pyrolysis
Main
Process
ETCH CVD IMPLANT & CVD & ETCH
Capacity · 100slm
· 200slm
· 500slm
· 1500slm
· 2000slm
3· 00slm
· 500slm
Scrubber
concept
Available
Gases
AsH3, PH3, Cl2, BCl3, CF4, SF6, HBr, CHF3, SiH4, WF6, TiCl4, PH3, HF, HCl, F2, NH3, TMA, TEMAZr, … SiH4, NH3, NF3, PH₃, TEOS, H₂, DCS, … CF4, CHF3, HBr, Cl2, SF6, BCl3, N2, NF3, S2F6, C3F8, …

DRE(%) Performance

Heat & Wet Scrubber Plasma & Wet Scrubber
Gas
(LPM)
N2
(LPM)
Efficiency
(%)
Gas
(LPM)
N2
(LPM)
Efficiency
(%)
SiH4 0.5 200 99.9 NF3 5 50 99.7
1 200 99.9 5 100 99.6
1.5 200 99.9 5 150 99.6
0.5 300 99.9 CF4 0.1 100 99.0
1 300 99.9 0.5 100 81.0
1.5 300 99.9 1 100 57.0
NF3 0.5 200 91 SF6 1 50 94.5
1 200 92.5 1 100 97.0
1.5 200 93.8 1 150 86.4

Qualified System manufacturer

Each system has supplied 100+ q’ty to global customers indirectly