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S E M I L I N K BEST SEMICONDUCTOR SOLUTION PROVIDER

EQUIPMENT_LDS(PDS)

Liquid(Precursor) Delivery System

Introduction

Specification

· N2 Purge Concept · Solvent Purge Concept
Dimension · W 1,350 x D 1,600 x H 1,900 mm · W 650 x D 800 x H 2,250 mm
Number of Stick · 4 sticks · 4 sticks
Canister Volume · TMA : 4~19 Dual,
· Solvent : 14L, Waste : 14L
· Bulk 19L(chemical supplier)
· Process 19L(NFC)
Delivery Concept · Refill : CT1, CT2 to Reservoir tank refill concept
· Process tank to Main tool : Continuous supply by interface with tool
· Refill : Bulk to Process tank refill concept
· Process tank to Main tool : Continuous supply by interface with tool
Refill control · Double monitoring by pressure&weight

Application

N2 Purge concept Solvent Purge concept
DRAM TEOS TEB TEPO BDEAS(SAM24) TMA USN-1
LTO520 DIPAS LTS525 LTO770 ECH HPK1
LTS525 LTO770 HCDS ATRP SFA-1 ZAC
HCDS ATRP AM16 4MS Star-ti ZM40
TMSA TMGa TDMAT TDMAS TEMAH TANTALUM
Tics ALFA4S Silcore Ticl4 SIA-3 HTB
TEDDY RENA SFA-1 ABA CP-Hf ACP-2
IPA Pyridine 2NTE Tris-DMAS TDMAS SP-3 (Hf )
AP(new) Yamuna(new) - - - -
NAND TEOS TEB TEPO LTO520 TMA ACP-2
DIPAS HCDS OMTCS 4MS USN-1 ZAC
TDMAS Ticl4 SFA-1 Pyridine ZM40 Star-ti(Zr)
2NTE - - - - -
Logic TEOS TEB TEPO LTO520 TMA TEMAH
HCDS ATRP MDEOS DEMS HPK1 HTB
OMTCS 4MS TMSA TDMAT - -
TDMAT Ticl4 - - - -